NSPA MLF110-06L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 6 Stud, Yellow, 12-10 Ga (10 MIN)
Item: 973065LF
Product Group: Ring TerminalsProduct Type: Heat Shrink, Crimp & Solder Ring Terminals
Insulation Material: Heat Shrink
Termination Type: Crimp, Solder & Heat Shrink
Size: 6 Stud
Temperature Range: 230°F
Wire Range: 12-10 Ga