Terminals > Ring-Terminals > Heat-Shrink-Ring-Terminals > Heat-Shrink,-Solder-&-Crimp
NSPA MLF110-08L, Lead-Free Heat Shrink, Crimp, & Solder Ring Terminal, 8 Stud, Yellow, 12-10 Ga (10 MIN)



Item:   973085LF

Product Group: Ring Terminals
Product Type: Heat Shrink, Crimp & Solder Ring Terminals
Insulation Material: Heat Shrink
Termination Type: Crimp, Solder & Heat Shrink
Size: 8 Stud
Temperature Range: 230°F
Wire Range: 12-10 Ga

Price
1+ I Ext. Price I 100+ I Ext. Price I 1000+ I Ext. Price
Qty in
Package 		In Stock
1.44900 I 14.49 I 1.15900 I 115.90 I 0.83300 I 833.00
10 EA ✓






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