Terminals > Push!On-Terminals > Heat-Shrink-Push!On-Terminals > Heat-Shrink,-Solder-&-Crimp-Push!On-Terminals
NSPA MLF6-18-250M, Lead-Free Heat Shrink, Crimp, & Solder Push-On Terminal Male, .250", Red, 22-18 Ga (10 MIN)



Item:   977725LF

Product Group: Push-On Terminals
Product Type: Heat Shrink, Solder, & Crimp Push-On Terminals
Insulation Material: Heat Shrink
Termination Type: Crimp, Solder & Heat Shrink
Size: 0.250"
Temperature Range: -67°F to 230°F (-55°C to 110°C)
Wire Range: 22-18 Ga
Standards: RoHS

Price
1+ I Ext. Price I 100+ I Ext. Price I 1000+ I Ext. Price
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Package
In Stock
1.23200 I 12.32 I 1.00100 I 100.10 I 0.72200 I 722.00
10 EA






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